DocumentCode
3506374
Title
Development and characterization of touch sensing devices for robotic applications
Author
Dahiya, Ravinder S. ; Valle, Maurizio ; Oboe, Roberto ; Cattin, Davide
Author_Institution
Italian Inst. of Technol., Genova, Italy
fYear
2009
fDate
3-5 Nov. 2009
Firstpage
4245
Lastpage
4250
Abstract
This paper presents the development of touch sensing chips for robotic applications and the experimental results from touch sensing elements on the chip. The high resolution tactile sensing chips have overall dimension of 1.5 cm à 1.5 cm and consist of 25 touch sensing elements. The touch sensing elements on the chip are the POSFET (Piezoelectric Oxide Semiconductor Field Effect Transistor) devices, obtained by depositing piezoelectric polymer directly on to the gate area of MOS transistor. Each sensing element has an effective sensing area of 0.5 mm à 0.5 mm. The tactile sensing chips are suitable for fingertips of a robot where large numbers of sensors are needed in a small space (typically 1 cm à 1.5 cm). The tactile sensing elements on the chip have been experimentally evaluated in time and frequency domain. Typically, protective rubber films of materials like PDMS (Polydimethylsiloxane) are used to improve robustness of the sensors, albeit, at the cost of reduced sensitivity. Such effects on the response of POSFET touch sensing elements are studied with PDMS films having different thicknesses.
Keywords
dexterous manipulators; field effect transistors; manipulator dynamics; manipulator kinematics; microprocessor chips; motion control; piezoelectric devices; tactile sensors; PDMS films; POSFET devices; high resolution tactile sensing chips; piezoelectric oxide semiconductor field effect transistor; polydimethylsiloxane; robotic applications; touch sensing devices; FETs; Frequency domain analysis; MOSFETs; Orbital robotics; Piezoelectric devices; Polymers; Protection; Robot sensing systems; Rubber; Tactile sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Industrial Electronics, 2009. IECON '09. 35th Annual Conference of IEEE
Conference_Location
Porto
ISSN
1553-572X
Print_ISBN
978-1-4244-4648-3
Electronic_ISBN
1553-572X
Type
conf
DOI
10.1109/IECON.2009.5415057
Filename
5415057
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