DocumentCode :
3506420
Title :
Torsion behavior simulation of Ni-coating SWCNT based on molecular dynamics
Author :
Hengyou Liao ; Fulong Zhu ; Wei Zhang ; Youkai Chen ; Shao Song ; Sheng Liu
Author_Institution :
State Key Lab. for Digital Manuf. Equip. & Technol., Huazhong Univ. of Sci. & Technol., Wuhan, China
fYear :
2012
fDate :
13-16 Aug. 2012
Firstpage :
1155
Lastpage :
1158
Abstract :
The effect of nickel coating upon the torsional behaviors of single-walled carbon nanotube (SWCNT) was defined, and torsion behaviors were investigated using the molecular dynamics (MD) simulation method. In this work, an armchair (6,6) carbon nanotube was considered. Both SWCNT and SCNT coating Ni (SWCNT-Ni) were analyzed at 0K and 300K. By simulating torsion process of SWCNT-Ni, mechanical behaviors of SWCNT-Ni could be defined. When torsion rate was relatively high, it had been reported that the torsional stiffness of SWCNT would reduce even at low temperature. However, to avoid the effect of torsion rate upon mechanical behaviors of SWCNT and SWCNT-Ni, an extremely low torque was applied which was corresponding to low torsion rate, and it was observed that the torsion angle of SWCNT and SWCNT-Ni were almost the same at the initial stage. That was to say, the metal coated atoms had little effect on torsional stiffness at extremely low torsion rate. When temperature rises, the effect of temperature begun to emerge. It was noted that the nickel atoms trended to rearrange, and the nickel atoms were more likely to migrate to the place of great deformation, and the torsion changed the curve of the outside surface, which caused the increase of Ni-C interactions.
Keywords :
carbon nanotubes; coatings; elastic constants; molecular dynamics method; nickel; torsion; Ni-C interaction; Ni-coating SWCNT; armchair (6,6) carbon nanotube; molecular dynamics; nickel atom; nickel coating; single-walled carbon nanotube; torsion angle; torsion behavior simulation; torsion rate; torsional stiffness; Abstracts; Carbon; Materials; Nanoscale devices; Nickel; Packaging; Switching circuits;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
Type :
conf
DOI :
10.1109/ICEPT-HDP.2012.6474812
Filename :
6474812
Link To Document :
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