Failure analysis of electroplating on sliver termination in multilayer ceramic capacitors (MLCCs)

Author

Long Gui ; Shengxiang Bao ; Xiaowen Zhang ; Zuwen Wang ; Chengshi Zhang ; Guanghua Shi

Author_Institution

State Key Lab. of Electron. Thin Films & Integrated Devices, Univ. of Electron. Sci. & Technol. of China, Chengdu, China

fYear

2012

fDate

13-16 Aug. 2012

Firstpage

1190

Lastpage

1193

Abstract

DuPont1187 was frequently used as a palatable silver termination in the multilayer ceramic capacitor (MLCC). A phenomenon occurred on the palatable silver termination, which cladding material had poor connation with the sliver termination of MLCC and the failure of weld ability after aging. Base on different sintering conditions (different sintering temperature, bearing of sintering and stove environment), SEM and EDS were carried out on the microstructure and micro-area composition analysis. The failure mechanism was brought out, that was because the pollution of sulfur which was brought in by stove ash. And the corresponding improvement measures were brought forward.

Keywords

ceramic capacitors; electroplating; failure analysis; scanning electron microscopy; sintering; DuPontl187; EDS; MLCC; SEM; cladding material; electroplating; failure analysis; micro-area composition analysis; microstructure analysis; multilayer ceramic capacitors; sintering bearing; sintering temperature; sliver termination; stove ash; weld ability; Capacitors; Ceramics; Electronic mail; Morphology; Scanning electron microscopy; Silver; Surface morphology;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on

Conference_Location

Guilin

Print_ISBN

978-1-4673-1682-8

Electronic_ISBN

978-1-4673-1680-4

Type

conf

DOI

10.1109/ICEPT-HDP.2012.6474820

Filename

6474820