DocumentCode :
3506600
Title :
Failure analysis of electroplating on sliver termination in multilayer ceramic capacitors (MLCCs)
Author :
Long Gui ; Shengxiang Bao ; Xiaowen Zhang ; Zuwen Wang ; Chengshi Zhang ; Guanghua Shi
Author_Institution :
State Key Lab. of Electron. Thin Films & Integrated Devices, Univ. of Electron. Sci. & Technol. of China, Chengdu, China
fYear :
2012
fDate :
13-16 Aug. 2012
Firstpage :
1190
Lastpage :
1193
Abstract :
DuPont1187 was frequently used as a palatable silver termination in the multilayer ceramic capacitor (MLCC). A phenomenon occurred on the palatable silver termination, which cladding material had poor connation with the sliver termination of MLCC and the failure of weld ability after aging. Base on different sintering conditions (different sintering temperature, bearing of sintering and stove environment), SEM and EDS were carried out on the microstructure and micro-area composition analysis. The failure mechanism was brought out, that was because the pollution of sulfur which was brought in by stove ash. And the corresponding improvement measures were brought forward.
Keywords :
ceramic capacitors; electroplating; failure analysis; scanning electron microscopy; sintering; DuPontl187; EDS; MLCC; SEM; cladding material; electroplating; failure analysis; micro-area composition analysis; microstructure analysis; multilayer ceramic capacitors; sintering bearing; sintering temperature; sliver termination; stove ash; weld ability; Capacitors; Ceramics; Electronic mail; Morphology; Scanning electron microscopy; Silver; Surface morphology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
Type :
conf
DOI :
10.1109/ICEPT-HDP.2012.6474820
Filename :
6474820
Link To Document :
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