Title :
Formation and growth of intermetallic compounds of Sn-2Ag-2.5Zn on Cu and Ni substrates
Author :
Yucheng Liu ; Tingbi Luo ; Anmin Hu ; Shangyuan Li ; Weizhen Wang ; Ming Li
Author_Institution :
Lab. of Microelectron. Mater. & Technol., Shanghai Jiao Tong Univ., Shanghai, China
Abstract :
The formation and growth of intermetallic compounds of Sn-2.0Ag-2.5Zn solder on Cu and Ni substrates after soldering and subsequent aging process have been investigated in this study. Ni films were electrodeposited on copper substrates. The interfacial micrographs of solder joints prepared at 250°C for 15s and aged for 24h, 96h and 216 h respectively. Double-layer IMC composed with Cu5Zn8 and Ag3Sn was observed at the interface of Sn-2Ag-2.5Zn and Cu couple, which was compact and acted as a barrier layer to confine the further growth of Cu-Sn IMC. On Ni barrier layer, a thin Ni3Sn4 film appeared between the solder and Ni-W layer, which is thin and smooth. After aging process, the thickness increased slowly and steadily, which revealed that Ni barrier layer acts as a promising barrier layer.
Keywords :
ageing; copper; electrodeposition; nickel; soldering; solders; substrates; tin alloys; Cu5Zn8; CuSn; Ni3Sn4; NiW; SnAGZn; aging process; barrier layer; copper substrates; double-layer IMC; electrodeposition; interfacial micrographs; intermetallic compounds; nickel substrates; solder joints; soldering; temperature 250 C; time 15 s; time 216 h; time 24 h; time 96 h; Abstracts; Aging; Educational institutions; Lead; Reliability; Tin;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
DOI :
10.1109/ICEPT-HDP.2012.6474830