• DocumentCode
    3506917
  • Title

    Integrating MRSN ratio and ANP to optimize process parameter of multiple-response injection molding process

  • Author

    Deng, Wei-Jaw

  • Author_Institution
    Grad. Sch. of Bus. Adm., Chung Hua Univ., Hsinchu
  • Volume
    2
  • fYear
    2008
  • fDate
    12-15 Oct. 2008
  • Firstpage
    2736
  • Lastpage
    2740
  • Abstract
    Multi-response signal to noise ratio (MRSN Ratio) technique is one of reformed Taguchi kind technique for using in multiple-quality response process parameter optimization. However, the assignment of each quality response weight in MRSN Ratio technique is a subjective or empirical process that may be unrealistic and possibly cause the misleading result of multiple-quality response process parameter optimization. Analytic Network Process (ANP) is a systemic process that applies ratio scales to evaluate internal relationship of dimensions, criterions, and alternatives. ANP method is popularly applied in setting criteria weight no mater in research or practice field. This research integrates MRSN Ratio and ANP to optimize process parameter of multiple-response injection molding process. The proposed approach overcomes the unrealistic problem of subjective weight setting in MRSN Ratio technique. Plastic injection molding process of modem bottom cover is used as a case study for comparing the performance between proposed approach and original MRSN Ratio technique. The comparison results show that proposed approach has better responsesiquest performance than original MRSN Ratio technique.
  • Keywords
    injection moulding; optimisation; production engineering computing; analytic network process; multi-response signal to noise ratio; multiple-quality response process; multiple-response injection molding process; plastic injection molding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Service Operations and Logistics, and Informatics, 2008. IEEE/SOLI 2008. IEEE International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-2012-4
  • Electronic_ISBN
    978-1-4244-2013-1
  • Type

    conf

  • DOI
    10.1109/SOLI.2008.4683000
  • Filename
    4683000