DocumentCode :
3506960
Title :
An innovative way to improve the reliability of gold wire in lighting emitting diodes (LEDs)
Author :
Run Chen ; Xiang Gao ; Xiaogang Liu ; Cao Li ; Sheng Liu
Author_Institution :
Stat Key Lab. for Digital Manuf. Equip. & Technol., Huazhong Univ. of Sci. & Technol., Wuhan, China
fYear :
2012
fDate :
13-16 Aug. 2012
Firstpage :
1266
Lastpage :
1270
Abstract :
As the most promising candidate for the realization of high-efficiency light sources for general lighting, the high power lighting emitting diodes (LEDs) still have reliability issues that hinder the large scale application of LED devices. Nowadays, the reliability is becoming an essential barrier for LED devices to substitute the traditional light sources. Before it is applied into mass production, many kinds of experiments under harsh conditions should be done to predict its reliability. Among those factors affecting LED´s reliability, fractures in the gold wire cannot be underestimated. Gold wire is often used for providing an electrical interconnection with outside power, while after some typical package reliability tests, such as the thermal cycling and thermal shock tests [3], there are fractures at two critical zones, the second bond and neck of the first bond. It is confirmed that the failure is mainly caused by the coefficient of thermal expansion (CTE) mismatch between gold and other materials and the large deformation of the silicone enclosing the gold wire.
Keywords :
electronics packaging; light emitting diodes; light sources; reliability; thermal expansion; thermal shock; wires (electric); CTE; LED; coefficient of thermal expansion; general lighting; gold wire; high power lighting emitting diodes; high-efficiency light sources; package reliability tests; thermal cycling; thermal shock tests; Abstracts; Copper; Gold; Light emitting diodes; Lighting; Performance evaluation; Reliability; FEM; LED; Reliability; Wire loop;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
Type :
conf
DOI :
10.1109/ICEPT-HDP.2012.6474836
Filename :
6474836
Link To Document :
بازگشت