DocumentCode
3507221
Title
The vacuum arc plasma source and its applications
Author
Schuelke, T. ; Becker, M. ; Grotjohn, T.A. ; Asmussen, J.
Author_Institution
Fraunhofer Center for Coatings & Laser Applications, Michigan State Univ., East Lansing, MI, USA
fYear
2004
fDate
1-1 July 2004
Firstpage
309
Abstract
Summary form only given. A vacuum arc is a gas discharge that maintains itself by providing the conductive medium between cathode and anode through evaporation of material from either one of the electrodes. The rather rapid material evaporation process occurs in microscopic spots on the electrode surface. The spot´s existence is highly dynamic and determined by the interaction between the surface near solid-state region of the electrode and the generated plasma in front of it. The material leaves the electrode region fully ionized and expands into the vacuum chamber with energies in the range of several tens of electron volts. This expanding plasma can be utilized e.g. for surface treatments by exposing a substrate to it. The phenomenon of the vacuum arc has been researched for more than a hundred years and the vacuum arc has meanwhile become a state-of-the-art plasma source for thin film deposition and plasma surface treatment applications. The paper gives an overview of the vacuum arc phenomenon and discusses basic discharge parameters for typical materials. Practical implementations of dc and pulsed discharges are introduced and compared with respect to current and future applications.
Keywords
electrodes; plasma materials processing; plasma sources; surface treatment; vacuum arcs; conductive medium; discharge parameters; electrode surface; fully ionized electrode region; gas discharge; microscopic spots; plasma generation; plasma surface treatment applications; pulsed discharges; rapid material evaporation process; surface near solid-state region; thin film deposition; vacuum arc phenomenon; vacuum arc plasma source; vacuum chamber; Cathodes; Conducting materials; Electrodes; Fault location; Plasma applications; Plasma materials processing; Plasma sources; Surface discharges; Surface treatment; Vacuum arcs;
fLanguage
English
Publisher
ieee
Conference_Titel
Plasma Science, 2004. ICOPS 2004. IEEE Conference Record - Abstracts. The 31st IEEE International Conference on
Conference_Location
Baltimore, MD, USA
ISSN
0730-9244
Print_ISBN
0-7803-8334-6
Type
conf
DOI
10.1109/PLASMA.2004.1339993
Filename
1339993
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