Latency analysis of metallic single walled Carbon nanotube (SWCNT) in circuit interconnections for VLSI

The Resistor Capacitor (RC) model is used to analyze circuit parameters for a CNT-bundle interconnects. In this paper the performance of the single CNT interconnection with Cu and Au using predetermined equations was attempted first. Due to poor yield of single CNT, bundle of CNT was analyzed and eventually the performance of the CNT-bundle, copper and gold interconnects was compared respectively at local, intermediate and global lengths. Finally it has been shown that the metallic SWCNT gives better performance than copper and gold interconnects for both the intermediate and global dimension.