A study of ultrasonic bonding flip chip process and its reliability for low temperature interconnection

Author

Yo-Han Song ; Sang-woon Seo ; Gu-Sung Kim

Author_Institution

Kangnam Univ., Yongin, South Korea

fYear

2012

fDate

13-16 Aug. 2012

Firstpage

1392

Lastpage

1394

Abstract

The purpose of studying is to confirm the reliability criteria of ultrasonic bonding with different chip size. To ensure this purpose, three kinds of specimens are prepared for compared evaluation, and bonding condition is secured by reliability assessment. For testing, chips are created with 5 mm × 5 mm, 10mm × 10mm, and 15mm × 15mm. The bond interconnections between chip and substrate are designed more than fifteen points with different daisy chain. Substrates called PCBs also prepared to fit each chip. The ultrasonic bonding process is progressed to use the anisotropic conductive films (ACF). For comparing the bonding process, all specimens also progressed using thermo-compression bonding.

Keywords

flip-chip devices; integrated circuit interconnections; integrated circuit reliability; low-power electronics; printed circuits; tape automated bonding; ultrasonic bonding; ACF; PCB; anisotropic conductive films; bond interconnections; bonding condition; chip size; low temperature interconnection; reliability assessment; reliability criteria; thermo-compression bonding; ultrasonic bonding flip chip process; ultrasonic bonding process; Abstracts; Bonding; Educational institutions; Electronic mail; Heating; Light emitting diodes; Reliability;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on

Conference_Location

Guilin

Print_ISBN

978-1-4673-1682-8

Electronic_ISBN

978-1-4673-1680-4

Type

conf

DOI

10.1109/ICEPT-HDP.2012.6474865

Filename

6474865