Failure mode of SAC305 lead-free solder joint under thermal stress

Author

Chao Huang ; Daoguo Yang ; Boyi Wu ; Lili Liang ; Yu Yang

Author_Institution

Guangxi Key Lab. of Manuf. Syst. & Adv. Manuf. Technol., Guilin Univ. of Electron. Technol., Guilin, China

fYear

2012

fDate

13-16 Aug. 2012

Firstpage

1395

Lastpage

1398

Abstract

With the progress of the lead-free in electronics industry, the reliability of SAC 305 lead-free solder joint is particularly important. According to typical components (BGA) suffering from thermal cycling and thermal aging test, present the fatigue life of the solder joint. Check the solder joint cracking at different cycling. Cross section and metallographic microscope are performed to inspect the microstructure of the lead-free solder joint. Study the solder joint failure analysis under thermal cycling and thermal aging. Guide subsequent reliability test and failure analysis.

Keywords

ageing; electronics industry; failure analysis; fatigue; metallography; soldering equipment; solders; cross section; electronics industry; failure mode; fatigue life; lead free solder joint failure analysis; metallographic microscope; microstructure; solder joint cracking; thermal aging reliability test; thermal cycling; thermal stress; Abstracts; Fatigue; Isothermal processes; Lead; Manufacturing; Surface treatment; Thermomechanical processes; Sn-3Ag-0.5Cu; crack; failure mode; thermal aging; thermal cycling;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on

Conference_Location

Guilin

Print_ISBN

978-1-4673-1682-8

Electronic_ISBN

978-1-4673-1680-4

Type

conf

DOI

10.1109/ICEPT-HDP.2012.6474866

Filename

6474866