Development of a new die-attach process and related bonding tool for multi-chip LED module

A new die-attach process was presented for the multi-chip LED module, and the related bonding tool for the LED module was also designed. With the new bonding process and the novel bonding tool, 21 LED chips have been attached onto a single substrate within one bonding process. The investigation of bonding chips´ appearance and thickness of interface layer were carried out to evaluate the die-attach performance. The die-attach process has been optimized by studying the effects of bonding force on the die-attach performance. The results showed this method can provide a high die-attach precision as well as the chip attachment consistency.