Title :
Fifth IEEE/CHMT International Electronic Manufacturing Technology Symposium - Design-to-Manufacturing Transfer Cycle. Proceedings 1988 (IEEE Cat. No.88CH2648-4)
Abstract :
Presents the front cover of the proceedings.
Keywords :
electronic equipment manufacture; inspection; packaging; printed circuits; soldering; bonding; inspection; integrated-circuit packaging; laser machining; manufacturing automation; manufacturing research; manufacturing systems; metallurgy; packaging design; plastics; printed wiring board assembly; process technology; sealing techniques; semiconductor fabrication; soldering; surface mount technology; tape automated bonding; thermocompression joining;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1988, Design-to-Manufacturing Transfer Cycle. Fifth IEEE/CHMT International
Conference_Location :
Lake Buena Vista, FL, USA
DOI :
10.1109/EMTS.1988.16135
