• DocumentCode
    3508402
  • Title

    Investigation of a 2/3-step voltage-based commutation method for matrix converters

  • Author

    Krauss, Sebastian ; Schwingal, Normann ; Hofmann, Wilfried

  • Author_Institution
    Dept. of Electr. Machines & Drives, Tech. Univ. Dresden, Dresden, Germany
  • fYear
    2012
  • fDate
    5-9 Feb. 2012
  • Firstpage
    397
  • Lastpage
    404
  • Abstract
    Matrix converter technology has grown up to a competitive alternative towards the common voltage source back-to-back inverter technology over the last years. Hence, the interest is still restricted to academic researchers. A process of industrial penetration is not yet initialized. The main reason for that is the current commutation of the matrix converter, which suffers from an omnipresent risk of load current interruption and input voltage short circuits. Provided that no additional hardware is used, the commutation in matrix converters is performed as a staggered multistep commutation. The papers subject is the investigation of a novel 2/3-step voltage-based commutation method, which is characterized by an increased safety against input voltage short circuits. Next to the basic commutation state machine, some numerical calculations on a space vector modulated matrix converter have been carried out to analyze the impact on output voltage and input current quality as well as the converter efficiency. The obtained theoretical results will be proved by experimental results, finally.
  • Keywords
    invertors; matrix convertors; numerical analysis; 2/3-step voltage-based commutation method; academic researchers; back-to-back inverter; input voltage short circuits; load current interruption; matrix converters; numerical calculations; space vector modulated matrix converter; Aerospace electronics; Commutation; Matrix converters; Modulation; Switches; Switching circuits; Vectors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applied Power Electronics Conference and Exposition (APEC), 2012 Twenty-Seventh Annual IEEE
  • Conference_Location
    Orlando, FL
  • Print_ISBN
    978-1-4577-1215-9
  • Electronic_ISBN
    978-1-4577-1214-2
  • Type

    conf

  • DOI
    10.1109/APEC.2012.6165850
  • Filename
    6165850