• DocumentCode
    3509721
  • Title

    Innovative ESD thermoplastic composites structured through melt flow processing

  • Author

    Narkis, Moshe ; Lidor, Gershon ; Vaxman, Anita ; Zuri, Limor

  • Author_Institution
    Dept. of Chem. Eng., Technion-Israel Inst. of Technol., Haifa, Israel
  • fYear
    1999
  • fDate
    28-30 Sept. 1999
  • Firstpage
    251
  • Lastpage
    259
  • Abstract
    The amount of carbon black required to impart electrical conductivity to an insulating polymer can be dramatically reduced by its selective localization in a multi-component system which includes the insulating polymer. This report describes property-structure relationships of polypropylene/nylon/glass fiber (PP/PA/GF) composites with consistent resistivity levels within the 10/sup 6/-10/sup 9/ ohms/sq range achieved at very low carbon black loadings (less than 2%). The quaternary composites studied structure spontaneously during the hot compounding/processing steps and have unique triple-percolation structures. The results were compared with typical carbon black filled materials, which usually contain 15 to 20 wt% carbon black and are too conductive to meet the 10/sup 6/-10/sup 9/ ohms/sq range.
  • Keywords
    carbon; conducting polymers; electrical conductivity; electrostatic discharge; filled polymers; glass fibre reinforced composites; packaging; percolation; protection; C; ESD thermoplastic composites; PP/PA/GF composites; carbon black; carbon black filled materials; carbon black loading; electrical conductivity; hot compounding/processing steps; insulating polymer; melt flow processing structured composites; multi-component system; polypropylene/nylon/glass fiber composites; property-structure relationships; quaternary composites; resistivity levels; selective localization; spontaneous structuring; triple-percolation structures; Carbon compounds; Conducting materials; Conductivity; Electrostatic discharge; Glass; Material storage; Organic materials; Plastic insulation; Polymers; Viscosity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Overstress/Electrostatic Discharge Symposium Proceedings, 1999
  • Conference_Location
    Orlando, FL, USA
  • Print_ISBN
    1-58637-007-X
  • Type

    conf

  • DOI
    10.1109/EOSESD.1999.819068
  • Filename
    819068