Title :
IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)
Abstract :
The following topics were dealt with: system design; on-chip interconnections; IC measurement; IC modelling; power distribution; SSN; transmission line modelling; and RF/microwave packaging
Keywords :
integrated circuit design; integrated circuit interconnections; integrated circuit measurement; integrated circuit modelling; integrated circuit noise; integrated circuit packaging; IC measurement; IC modelling; RF packaging; SSN; microwave packaging; on-chip interconnections; power distribution; simultaneous switching noise; system design; transmission line modelling;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1999
Conference_Location :
San Diego, CA, USA
Print_ISBN :
0-7803-5597-0
DOI :
10.1109/EPEP.1999.819179
