Title :
Electrical characterization of S/390 MCM packages from S-parameter measurements below 3 GHz
Author :
Ktata, Faiez ; Arz, Uwe ; Grabinski, Hartmut
Author_Institution :
Lab. fur Inf. Technol., Hannover Univ., Germany
Abstract :
In this work, we investigate the electrical performance of critical signal paths in IBM S/390 MCM packages. We present lumped RLC-models suitable for standard circuit simulators operating in the time domain, e.g. SPICE. The models are developed from finite element simulations of typical signal path segments. By comparing S-parameters from simulations of the models to two-port network analyzer measurements, we validate the models in a frequency range up to 3 GHz
Keywords :
S-parameters; SPICE; circuit simulation; finite element analysis; integrated circuit interconnections; integrated circuit measurement; integrated circuit modelling; integrated circuit packaging; lumped parameter networks; multichip modules; time-domain analysis; 3 GHz; IBM S/390 MCM packages; S-parameter measurements; S-parameters; SPICE; circuit simulators; critical signal paths; electrical characterization; electrical performance; finite element simulations; lumped RLC-models; models; signal path segments; simulations; time domain operation; two-port network analyzer measurements; Circuit simulation; Electric variables measurement; Finite element methods; Frequency measurement; Geometry; Integrated circuit interconnections; Packaging; Scattering parameters; Semiconductor device measurement; Semiconductor device modeling;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1999
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-5597-0
DOI :
10.1109/EPEP.1999.819197
