Numerical analysis of surface waves on a grounded dielectric plane using the finite difference time domain method

Author

Schuster, Christian ; Fichtner, Wolfgang

Author_Institution

Dept. of Electr. Eng., Swiss Fed. Inst. of Technol., Zurich, Switzerland

fYear

1999

fDate

1999

Firstpage

95

Lastpage

98

Abstract

In this paper, the FDTD method is used to analyze the electromagnetic behavior of surface waves on a grounded dielectric plane. Dispersion characteristics, scattering from plane truncations, excitation and interference on a microstrip right angle bend are discussed. The knowledge of these fundamental properties is essential if one wishes to optimize the electrical performance of packages and interconnects with respect to surface wave crosstalk and radiation losses

Keywords

crosstalk; dispersion (wave); electromagnetic field theory; electromagnetic wave interference; electromagnetic wave scattering; finite difference time-domain analysis; integrated circuit design; integrated circuit interconnections; integrated circuit packaging; losses; microstrip discontinuities; surface electromagnetic waves; FDTD method; dispersion characteristics; electrical performance optimization; electromagnetic behavior; excitation; finite difference time domain method; grounded dielectric plane; interconnects; interference; microstrip right angle bend; numerical analysis; packages; plane truncation scattering; surface wave crosstalk; surface wave radiation losses; surface waves; Dielectrics; Electromagnetic analysis; Electromagnetic radiative interference; Electromagnetic scattering; Finite difference methods; Microstrip; Numerical analysis; Packaging; Performance loss; Surface waves;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 1999

Conference_Location

San Diego, CA

Print_ISBN

0-7803-5597-0

Type

conf

DOI

10.1109/EPEP.1999.819201

Filename

819201