DocumentCode :
3510669
Title :
Numerical analysis of surface waves on a grounded dielectric plane using the finite difference time domain method
Author :
Schuster, Christian ; Fichtner, Wolfgang
Author_Institution :
Dept. of Electr. Eng., Swiss Fed. Inst. of Technol., Zurich, Switzerland
fYear :
1999
fDate :
1999
Firstpage :
95
Lastpage :
98
Abstract :
In this paper, the FDTD method is used to analyze the electromagnetic behavior of surface waves on a grounded dielectric plane. Dispersion characteristics, scattering from plane truncations, excitation and interference on a microstrip right angle bend are discussed. The knowledge of these fundamental properties is essential if one wishes to optimize the electrical performance of packages and interconnects with respect to surface wave crosstalk and radiation losses
Keywords :
crosstalk; dispersion (wave); electromagnetic field theory; electromagnetic wave interference; electromagnetic wave scattering; finite difference time-domain analysis; integrated circuit design; integrated circuit interconnections; integrated circuit packaging; losses; microstrip discontinuities; surface electromagnetic waves; FDTD method; dispersion characteristics; electrical performance optimization; electromagnetic behavior; excitation; finite difference time domain method; grounded dielectric plane; interconnects; interference; microstrip right angle bend; numerical analysis; packages; plane truncation scattering; surface wave crosstalk; surface wave radiation losses; surface waves; Dielectrics; Electromagnetic analysis; Electromagnetic radiative interference; Electromagnetic scattering; Finite difference methods; Microstrip; Numerical analysis; Packaging; Performance loss; Surface waves;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 1999
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-5597-0
Type :
conf
DOI :
10.1109/EPEP.1999.819201
Filename :
819201
Link To Document :
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