Title :
High performance socket characterization technique for microprocessors
Author :
Figueroa, David G. ; Chung, Chee Yee ; Cornelius, Michael D. ; Yew, Teong Guan ; Li, Yuan-Liang
Author_Institution :
Intel Corp., Chandler, AZ, USA
Abstract :
At present, most socket suppliers provide different specifications and measurement data based on their own “in-house” characterization set-up, which has resulted in a variety of different data reported. To provide a means for designers to correctly decide on a socket or vendor, a standard specification and standard characterization method are necessary. This standard specification will also correctly represent the physical and electrical behavior of the socket. In this paper, a new socket specification is given. To more accurately estimate the socket parasitics, a new 3D modeling method is proposed. A new measurement technique is defined for precisely extracting a socket´s model component values. The measurement technique utilizes a de-embedding process and a unique test fixture to ensure the final parasitic values included only the parasitics of the socket. The difference between modeling and measured socket parasitics is within 10%. This technique has been demonstrated and adopted for all Intel socket suppliers
Keywords :
electric connectors; integrated circuit measurement; integrated circuit modelling; integrated circuit packaging; microprocessor chips; standards; 3D modeling method; Intel socket suppliers; de-embedding process; electrical behavior; in-house characterization; measurement technique; microprocessors; modeling; physical behavior; socket characterization technique; socket measurement data; socket model component value extraction; socket parasitics; socket specifications; socket supply; standard socket characterization method; standard socket specification; test fixture; Crosstalk; Fixtures; Impedance; Load flow; Load flow analysis; Measurement techniques; Microprocessors; Pins; Sockets; Testing;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1999
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-5597-0
DOI :
10.1109/EPEP.1999.819208