• DocumentCode
    3511079
  • Title

    Enhanced skin effect for partial element equivalent circuit (PEEC) models

  • Author

    Coperich, Karen M. ; Ruehli, Albert E. ; Cangellaris, Andreas

  • Author_Institution
    Illinois Univ., Urbana, IL, USA
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    189
  • Lastpage
    192
  • Abstract
    A convenient skin effect model for the partial element equivalent circuits (PEEC) technique is the so-called volume filament technique. This approach is an integral part of the basic PEEC model if the conductor cross-sections are subdivided into cells. This model is efficient for geometries and frequencies where the skin depth is moderate compared to the conductor thickness. However, the computational cost may be too high for the case where the skin depth is a small fraction of the cross-section, especially if it is subdivided into uniform cells. In this paper, a model is presented that is suitable for all frequency regimes of interest, and thus is most appropriate for transient interconnect analysis using a full-wave model denoted as (Lp, P, Zs, τ)PEEC, to indicate the inclusion of the complex skin effect model Zs
  • Keywords
    equivalent circuits; integrated circuit interconnections; integrated circuit metallisation; integrated circuit modelling; integrated circuit packaging; skin effect; transient analysis; PEEC model; PEEC models; complex skin effect model; computational cost; conductor cross-section cell subdivision; conductor thickness; enhanced skin effect; frequency regimes; full-wave model; partial element equivalent circuit models; partial element equivalent circuits technique; skin depth; skin effect model; transient interconnect analysis; volume filament technique; Conductors; Current density; Current distribution; Electronics packaging; Equivalent circuits; Frequency; Power system transients; Skin effect; Solid modeling; Transient analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 1999
  • Conference_Location
    San Diego, CA
  • Print_ISBN
    0-7803-5597-0
  • Type

    conf

  • DOI
    10.1109/EPEP.1999.819223
  • Filename
    819223