Low-cost, high-volume packaging techniques for silicon sensors and actuators

NovaSensor has developed novel, low-cost packaging techniques for silicon sensors and actuators, which permit the use of these devices in applications which were previously cost-prohibitive. The authors review the design philosophy and design process for several such packages, and discuss them against the background of previous packaging techniques with an eye toward future sensor and package developments. They show how needs for configurability are met while retaining the benefits of an efficient modern semiconductor packaging approach.<>