Burn-in method study of surface mounted plastic encapsulated devices and board-level verification

Industry-level plastic encapsulated devices have been used gradually in high reliability field. The screening and qualification procedures of package-level and board-level are necessary for high reliability, in which burn-in is a key part. In this paper, board-level test was carried out based on implantable brain simulator circuits of our lab. A burn-in method for surface mounted plastic encapsulated devices is presented in this paper, and the junction temperature control is based on case temperature control and equivalent thermal resistance value between case and junction, board-level test was carried out after package-level devices burn-in for avoiding devices potential invalidation caused by unsuitable stress during burn-in.