DocumentCode
3511299
Title
77 GHz band surface mountable ceramic package
Author
Koriyama, Shinichi ; Kitazawa, Kenji ; Minamiue, Hidehiro ; Fujii, Mikio
Author_Institution
R&D Center, Kyocera Corp., Kagoshima, Japan
fYear
1999
fDate
1999
Firstpage
225
Lastpage
228
Abstract
We have developed a ceramic package for 77 GHz millimeter wave applications. The package has a new terminal structure for surface mount, and a feedthrough for electromagnetic coupling. We confirmed that the surface mounted package shows high transmission characteristics
Keywords
MIMIC; ceramic packaging; electromagnetic coupling; integrated circuit interconnections; integrated circuit packaging; surface mount technology; 77 GHz; ceramic package; electromagnetic coupling; feedthrough; millimeter wave applications; package terminal structure; surface mount; surface mountable ceramic package; surface mounted package; transmission characteristics; Ceramics; Costs; Dielectric losses; Electromagnetic coupling; Microstrip; Millimeter wave radar; Millimeter wave technology; Packaging; Signal design; Surface waves;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1999
Conference_Location
San Diego, CA
Print_ISBN
0-7803-5597-0
Type
conf
DOI
10.1109/EPEP.1999.819231
Filename
819231
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