Title :
Analysis on failure modes and mechanisms of LED
Author :
Guoguang Lu ; Shaohua Yang ; Yun Huang
Author_Institution :
Key Lab. for Reliability Phys. & Applic. Technol. of Electr. Component, CEPREI, Guangzhou, China
Abstract :
The reliability of LED is key to its application system. In this paper, the frequent failure modes and mechanisms such as chip failure and packaging failure were investigated through several failure analysis cases. Based on these analysis results, several methods to improve LED´s reliability are reported in this paper.
Keywords :
electronics packaging; failure analysis; light emitting diodes; reliability; LED mechanism; LED reliability; light emitting diode; packaging failure analysis; semiconductor chip failure analysis; Assembly; Failure analysis; LED lamps; Light emitting diodes; Liquid crystal displays; Packaging; Power system reliability; Temperature; Thermal stresses; Wire; LED; chip failure; failure mechanism; failure mode; packaging failure; reliability;
Conference_Titel :
Reliability, Maintainability and Safety, 2009. ICRMS 2009. 8th International Conference on
Conference_Location :
Chengdu
Print_ISBN :
978-1-4244-4903-3
Electronic_ISBN :
978-1-4244-4905-7
DOI :
10.1109/ICRMS.2009.5270043
