DocumentCode
3511761
Title
Analysis on failure modes and mechanisms of LED
Author
Guoguang Lu ; Shaohua Yang ; Yun Huang
Author_Institution
Key Lab. for Reliability Phys. & Applic. Technol. of Electr. Component, CEPREI, Guangzhou, China
fYear
2009
fDate
20-24 July 2009
Firstpage
1237
Lastpage
1241
Abstract
The reliability of LED is key to its application system. In this paper, the frequent failure modes and mechanisms such as chip failure and packaging failure were investigated through several failure analysis cases. Based on these analysis results, several methods to improve LED´s reliability are reported in this paper.
Keywords
electronics packaging; failure analysis; light emitting diodes; reliability; LED mechanism; LED reliability; light emitting diode; packaging failure analysis; semiconductor chip failure analysis; Assembly; Failure analysis; LED lamps; Light emitting diodes; Liquid crystal displays; Packaging; Power system reliability; Temperature; Thermal stresses; Wire; LED; chip failure; failure mechanism; failure mode; packaging failure; reliability;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability, Maintainability and Safety, 2009. ICRMS 2009. 8th International Conference on
Conference_Location
Chengdu
Print_ISBN
978-1-4244-4903-3
Electronic_ISBN
978-1-4244-4905-7
Type
conf
DOI
10.1109/ICRMS.2009.5270043
Filename
5270043
Link To Document