Title :
Research progress on constitutive model of solder joints in micro-electronic packing
Author :
Shao, Jiang ; Zeng, Chenhui ; Xu, Wenzheng ; Shan, Kunlun
Author_Institution :
Aero Combined Environ. Lab., China Aero-Polytechnology Establ., Beijing, China
Abstract :
The thermal-mechanical reliability of solder joints has been a key issue in the reliability assessment of electronic packaging. The recent developments in constitutive model of solder joints are summarized. Numerous constitutive models are proposed such as elastoplastic model, creep model, separated viscoplastic model, uniformed viscoplastic model and constitutive model based on fracture mechanics. At last, some suggestions for future investigations are also made.
Keywords :
creep; elastoplasticity; fracture mechanics; integrated circuit modelling; integrated circuit packaging; integrated circuit reliability; solders; thermomechanical treatment; viscoplasticity; creep model; elastoplastic model; fracture mechanics; microelectronic packing; separated viscoplastic model; solder joint constitutive model; thermal-mechanical reliability; uniformed viscoplastic model; Capacitive sensors; Creep; Deformable models; Electronic mail; Electronics packaging; Predictive models; Soldering; Strain measurement; Stress; Temperature; Constitutive model; electronic packaging; solder joints; viscoplastic;
Conference_Titel :
Reliability, Maintainability and Safety, 2009. ICRMS 2009. 8th International Conference on
Conference_Location :
Chengdu
Print_ISBN :
978-1-4244-4903-3
Electronic_ISBN :
978-1-4244-4905-7
DOI :
10.1109/ICRMS.2009.5270045
