• DocumentCode
    3511881
  • Title

    Quantitative assessment approach of RET based on interference model

  • Author

    Yao, Jun ; Liu, Jia ; Zhu, Zhen-Yu

  • Author_Institution
    Dept. of Syst. Eng., Beihang Univ., Beijing, China
  • fYear
    2009
  • fDate
    20-24 July 2009
  • Firstpage
    1276
  • Lastpage
    1279
  • Abstract
    RET (reliability enhancement testing) is the most advanced technology from western countries. RET´s concept, process and stress limit classification were introduced. The basic theory of RET was explained. Interference model was introduced into RET, to settle the problem that RET couldn´t be analyzed quantitatively. The failure mechanism occurred in RET was analyzed by using interference model. By analyzing the interdependence between the operating stress found in RET and the stress in actual operation environment, the formula for reliable probability was deduced. Then an example was given to explain this approach´s feasibility. RET could improve the reliability of products by improving the quality of design and manufacturing process. By using the interference model and the deuced formula, two ways of improving the reliability of products were analyzed. And also, the basic principle of RET was explained based on the model.
  • Keywords
    failure analysis; probability; reliability; design quality; failure mechanism; interference model; manufacturing process; product reliability; quantitative assessment approach; reliability enhancement testing; reliable probability; stress limit classification; Electronic switching systems; Failure analysis; Interference; Manufacturing processes; Process design; Reliability engineering; Stress; System testing; Systems engineering and theory; Temperature; interference model; quantitative analysis; reliability enhancement testing; reliability estimation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability, Maintainability and Safety, 2009. ICRMS 2009. 8th International Conference on
  • Conference_Location
    Chengdu
  • Print_ISBN
    978-1-4244-4903-3
  • Electronic_ISBN
    978-1-4244-4905-7
  • Type

    conf

  • DOI
    10.1109/ICRMS.2009.5270051
  • Filename
    5270051