• DocumentCode
    3512388
  • Title

    A test probe for TSV using resonant inductive coupling

  • Author

    Rashidzadeh, R. ; Basith, Iftekhar Ibne

  • Author_Institution
    Department of Electrical and Computer Engineering, University of Windsor, Windsor, ON, Canada
  • fYear
    2013
  • fDate
    10-12 Sept. 2013
  • Firstpage
    1
  • Lastpage
    10
  • Abstract
    A contactless TSV probe based on the principle of resonant inductive coupling is presented in this work. The proposed scheme allows TSV data observation up to 2Gbps when the probe and TSV are 15μm apart.
  • Keywords
    Couplings; Inductors; Probes; RLC circuits; Resonant frequency; Testing; Through-silicon vias;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Teletraffic Congress (ITC), 2013 25th International
  • Conference_Location
    Shanghai
  • Type

    conf

  • DOI
    10.1109/ITC.2013.6917153
  • Filename
    6917153
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3512388