• DocumentCode
    3512579
  • Title

    Ruggedness analysis of 600V 4H-SiC JBS diodes under repetitive avalanche conditions

  • Author

    Huang, Xing ; Wang, Gangyao ; Jiang, Li ; Huang, Alex Q.

  • Author_Institution
    Future Renewable Electr. Energy Delivery & Manage. Syst. Center, North Carolina State Univ., Raleigh, NC, USA
  • fYear
    2012
  • fDate
    5-9 Feb. 2012
  • Firstpage
    1688
  • Lastpage
    1691
  • Abstract
    The repetitive avalanche reliability of power rectifiers is crucial to the safe operation of the hard switching power converters under extreme conditions as well as transient voltage suppression (TVS) applications. In this paper, the ruggedness of two state-of-art 4H-SiC Junction Barrier Schottky (JBS) diodes under repetitive avalanche stresses has been studied. Two different post-stress behaviors have been observed: VF degradation and BV drifting for the two different JBS diodes. The VF degradation could happen to the device that avalanches in the active area. However, for the device that avalanches in the edge termination, the repetitive avalanche stress greatly increases the breakdown voltage for about 100V. These results bring new concerns for SiC devices that are expected to be operated in avalanche conditions.
  • Keywords
    Schottky diodes; avalanche diodes; power semiconductor diodes; silicon compounds; stress analysis; 4H-SiC JBS diodes; SiC; TVS application; breakdown voltage drifting; forward-voltage drop degradation; hard-switching power converters; junction barrier Schottky diodes; operation safety; post-stress behaviors; power rectifiers; repetitive avalanche reliability; repetitive-avalanche conditions; repetitive-avalanche stress; ruggedness analysis; transient voltage suppression application; voltage 600 V; Degradation; Electric breakdown; Materials; Reliability; Semiconductor diodes; Silicon carbide; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applied Power Electronics Conference and Exposition (APEC), 2012 Twenty-Seventh Annual IEEE
  • Conference_Location
    Orlando, FL
  • Print_ISBN
    978-1-4577-1215-9
  • Electronic_ISBN
    978-1-4577-1214-2
  • Type

    conf

  • DOI
    10.1109/APEC.2012.6166048
  • Filename
    6166048