DocumentCode :
3512818
Title :
Forced air cooled quasi-planar 60A, 600μH inductor for a plasma cutting power supply
Author :
Kamath, Girish ; Chin, Wayne ; LeBlanc, Norman ; Tillman, Paul
Author_Institution :
Hypertherm, Inc., Hanover, NH, USA
fYear :
2012
fDate :
5-9 Feb. 2012
Firstpage :
1747
Lastpage :
1753
Abstract :
This paper presents the design and experimental results of a forced air cooled 60A, 600 μH quasi-planar buck converter inductor for a plasma cutting application. The inductor consists of PCBs (Printed Circuit Boards) with air ducts between the adjacent boards and conventional powder iron E cores. The winding assembly is simple and enables direct cooling of the PCB layers. A multi-physics based approach that considers factors like winding loss, air flow and heat transfer is used for the component design. Results from a 3-D FEA (Finite Element Analysis) based model that analyzes these physics are compared with experimental data from a proof-of-concept inductor prototype. A reasonable correlation is observed with average temperature errors in the 10-20% range. Factors affecting the performance of the model are also discussed. A comparison with an equivalent conventional inductor shows a four-fold increase in cooling efficiency and a three-fold reduction in copper usage. Thus, this approach is seen to be cost competitive and feasible for this application.
Keywords :
cutting; finite element analysis; plasma applications; power convertors; power inductors; power supplies to apparatus; printed circuits; windings; PCB layers; air flow; average temperature errors; current 60 A; direct cooling; equivalent conventional inductor; finite element analysis; forced air cooled quasiplanar buck converter inductor; heat transfer; plasma cutting power supply; printed circuit boards; winding assembly; Copper; Ducts; Heat transfer; Inductors; Plasmas; Power supplies; Windings;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Applied Power Electronics Conference and Exposition (APEC), 2012 Twenty-Seventh Annual IEEE
Conference_Location :
Orlando, FL
Print_ISBN :
978-1-4577-1215-9
Electronic_ISBN :
978-1-4577-1214-2
Type :
conf
DOI :
10.1109/APEC.2012.6166058
Filename :
6166058
Link To Document :
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