• DocumentCode
    3514459
  • Title

    A pixel-by-pixel thermal conductance tuning mechanism for uncooled microbolometers

  • Author

    Topaloglu, Nezih ; Nieva, Patricia M. ; Yavuz, M. ; Huissoon, Jan P.

  • Author_Institution
    Mech. & Mechatron. Eng., Univ. of Waterloo, Waterloo, ON
  • fYear
    2008
  • fDate
    15-15 Oct. 2008
  • Firstpage
    201
  • Lastpage
    204
  • Abstract
    The increase in the demand of using infrared detectors for thermal imaging of high temperature scenes initiated the research in microbolometer arrays with high operation temperature range. An efficient way of increasing this range is tuning the thermal conductance of the microbolometer array by electrostatic actuation, which is achieved by applying an actuation voltage to the substrate. However, using the substrate for actuation does not support pixel-by-pixel actuation, limiting the capabilities of the tunability. In this research, we demonstrate applying the actuation voltage to the micromirror which is located below the microbolometer. To avoid contact of the microbolometer to the micromirror, stoppers are used. We report that the thermal conductance is doubled at an actuation voltage of 12 volts, making it an efficient mechanism that can be used at next generation adaptive microbolometers.
  • Keywords
    bolometers; electrostatic actuators; micro-optomechanical devices; micromirrors; photodetectors; thermal conductivity; actuation voltage; electrostatic actuation; microbolometer arrays; micromirror; pixel-by-pixel thermal conductance tuning; voltage 12 V; Electrostatic actuators; Infrared detectors; Layout; Optical imaging; Performance gain; Temperature distribution; Temperature sensors; Thermal conductivity; Thermal engineering; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems and Nanoelectronics Research Conference, 2008. MNRC 2008. 1st
  • Conference_Location
    Ottawa, Ont.
  • Print_ISBN
    978-1-4244-2920-2
  • Electronic_ISBN
    978-1-4244-2921-9
  • Type

    conf

  • DOI
    10.1109/MNRC.2008.4683413
  • Filename
    4683413