• DocumentCode
    3514564
  • Title

    Partial discharge behaviour in laminated structures: effect of gaseous diffusion and penetration [turbine generators]

  • Author

    Sedding, H.G. ; Braun, J.M.

  • Author_Institution
    Ontario Hydro, Toronto, Ont., Canada
  • fYear
    1989
  • fDate
    3-6 Jul 1989
  • Firstpage
    127
  • Lastpage
    131
  • Abstract
    Studies to determine the transport mechanism of hydrogen gas in laminated dielectric materials of practical interest have been performed. Partial-discharge activity was investigated as a function of pressure reduction. The controlled variables were composition of the insulation system, ambient pressure, temperature, and molecular size of the penetrating gas. The egress times indicate that a temporary reduction in hydrogen pressure to more easily detect partial-discharge activity in a turbine generator is a feasible procedure. However, the short time lags found are in contrast to those predicted theoretically for solid slabs. They are also contrary to experience with homogeneous epoxy resins. Therefore it is probable that the predominant gas transport mechanism is effusion, due to minute cracks in the insulation, rather than molecular diffusion
  • Keywords
    composite insulating materials; laminates; machine insulation; partial discharges; turbogenerators; H2 gas transport mechanism; ambient pressure; cracks; effusion; egress times; gaseous diffusion effects; homogeneous epoxy resins; insulation system composition; laminated dielectric materials; molecular size; partial-discharge activity; turbine generator; Control systems; Dielectric materials; Dielectrics and electrical insulation; Gas insulation; Hydraulic turbines; Hydrogen; Partial discharges; Pressure control; Size control; Temperature control;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Conduction and Breakdown in Solid Dielectrics, 1989., Proceedings of the 3rd International Conference on
  • Conference_Location
    Trondheim
  • Type

    conf

  • DOI
    10.1109/ICSD.1989.69174
  • Filename
    69174