Copper Nanotubes for Packaging Applications

In this paper, we present a process for fabricating Copper (Cu) nanotubes, which can be utilized for novel electrical interconnect materials. Because of superior properties in electromigration and thermal management to aluminum, Cu technology has been attractive to the semiconductor industry. Cu nanotubes can be fabricated by electrodeposition using alumina nanopore templates. Nanotubes can provide high surface-to-volume ratio in nanostructures compared to nanorods. In addition, nanotubes provide lower resistively and high thermal conductivity. Cu nanotube arrays were electrodeposited into alumina nanopore membranes with pore diameters of approximately 30 nm and 50 nm, with estimated porosity of 43%, by nano template-based electrodeposition.