Thermal analysis and validation of packaging for 100W and higher GaN MMIC power amplifiers

We have developed a thermal analysis methodology, packaging design process and validation procedure demonstrating that GaN power amplifiers, having greater than 100W of RF output power, can be managed thermally in practical higher level assemblies. Microscopic and macroscopic models were used to evaluate performance. Novel thermal dissipation test structures were designed, fabricated and measured at dissipation densities of greater than 15,000W/cm² of active area.