• DocumentCode
    3514892
  • Title

    Micro-fabrication on 3-D surface by electrostatic induced lithography

  • Author

    Yu, W. ; Cargill, S. ; Leonard, M. ; Desmulliez, M.P.Y.

  • Author_Institution
    Microsyst. Eng. Centre, Heriot-Watt Univ., Edinburgh
  • fYear
    2008
  • fDate
    1-4 Sept. 2008
  • Firstpage
    111
  • Lastpage
    116
  • Abstract
    This paper presents a novel technology to pattern polymer material deposited onto 2D and 3D surfaces at the micro- and mesoscopic scales. Electro-hydrodynamic instability patterning (EHDIP) relies on the formation of features induced by electrostatic pressure. Unlike previous work reported elsewhere in nano-patterning, we focused on the fabrication of structures from the micro- to the meso-scale. The electrostatic induced lithography technique is proven to work with not only DC voltage but also AC voltage at frequency up to 1 KHz. Besides planar substrates, patterning is carried out on 3D surfaces like the inner surface of a half hollow cylinder, which is extremely difficult by traditional photolithography methods. The whole fabrication process is found to be fast, cost-effective and no photosensitive material is needed as in traditional photolithography. Applications of this technology include microfluidics, MEMS and wafer bumping.
  • Keywords
    microfluidics; micromechanical devices; photolithography; 2D surfaces; 3D surfaces; Electro-hydrodynamic instability patterning; MEMS; electrostatic induced lithography; electrostatic pressure; half hollow cylinder; mesoscopic scales; micro-fabrication; microfluidics; microscales; nano-patterning; photolithography; planar substrates; wafer bumping; Electric potential; Electrodes; Electrostatics; Fabrication; Lithography; Microchannel; Micromechanical devices; Pattern formation; Polymers; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
  • Conference_Location
    Greenwich
  • Print_ISBN
    978-1-4244-2813-7
  • Electronic_ISBN
    978-1-4244-2814-4
  • Type

    conf

  • DOI
    10.1109/ESTC.2008.4684334
  • Filename
    4684334