• DocumentCode
    3514900
  • Title

    1200 V SiC “Super” Junction Transistors operating at 250 °C with extremely low energy losses for power conversion applications

  • Author

    Singh, Ranbir ; Sundaresan, Siddarth ; Lieser, Eric ; Digangi, Michael

  • Author_Institution
    GeneSiC Semicond., Inc., Dulles, VA, USA
  • fYear
    2012
  • fDate
    5-9 Feb. 2012
  • Firstpage
    2516
  • Lastpage
    2520
  • Abstract
    The electrical performance of GeneSiC´s 1200 V/7 A SiC Super Junction Transistor (SJT) is compared with three best-in-class commercial Si IGBTs in this paper. Low leakage currents of <;100 μA at 325 °C, turn-on and turn-off switching transients of <;15 ns at 250 °C, current gain as high as 72, on-resistance as low as 235 mΩ, second-breakdown-free square RBSOA, and short-circuit withstand time of 22 μs were measured on the SiC SJTs. For switching 7 A and 800 V at 100 kHz, the SiC SJT + GeneSiC SiC Schottky rectifier as Free Wheeling Diode (FWD) achieved a total power loss reduction of about 64% when compared to the best all-Si IGBT+FWD configuration and a power loss reduction of about 47 %, when compared to the best Si IGBT + SiC Schottky FWD.
  • Keywords
    Schottky diodes; leakage currents; power conversion; power semiconductor diodes; rectifiers; short-circuit currents; silicon compounds; wide band gap semiconductors; SJT; Schottky FWD; Schottky rectifier; SiC; commercial IGBT; current 7 A; free wheeling diode; frequency 100 kHz; low energy loss; low leakage current; power conversion application; resistance 235 mohm; second breakdown-free square RBSOA; super junction transistor; temperature 250 degC; temperature 325 degC; time 22 mus; total power loss reduction; turn-off switching transient; turn-on switching transient; voltage 1200 V; voltage 800 V; Insulated gate bipolar transistors; Logic gates; Silicon; Silicon carbide; Switches; Temperature; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applied Power Electronics Conference and Exposition (APEC), 2012 Twenty-Seventh Annual IEEE
  • Conference_Location
    Orlando, FL
  • Print_ISBN
    978-1-4577-1215-9
  • Electronic_ISBN
    978-1-4577-1214-2
  • Type

    conf

  • DOI
    10.1109/APEC.2012.6166176
  • Filename
    6166176