Influence of special cleaning compounds on PCBs solderability

Author

Harant, Petr ; Steiner, Frantisek ; Stary, Jiri ; Stejskal, Petr

Author_Institution

Univ. of West Bohemia, Plzen

fYear

2008

fDate

1-4 Sept. 2008

Firstpage

117

Lastpage

120

Abstract

Paper deals with results of solderability testing of printed circuit boards (PCBs). The target of solderability testing was an assessment of cleaning substance influence on solderability. Several types of cleaning substances were used for PCB cleaning. Isopropylalcohol and special cleaning liquids were applied on PCBs before solderability testing. These cleaning liquids shall clean up the surface of PCB from impurities. Most often used lead-free surface finishes were tested (coupons of printed circuit boards with surface finishes galvanic tin, immersion tin, ENIG (electro less nickel immersion gold), OSP (organic solderability preservative) and pure copper).

Keywords

printed circuits; soldering; surface cleaning; Isopropylalcohol; PCB solderability; area of spread method; electro less nickel immersion gold; galvanic tin; immersion tin; lead- free surface; organic solderability preservative; printed circuit boards; solderability assessment; solderability testing; special cleaning compounds; special cleaning liquids; wetting balance test; Circuit testing; Environmentally friendly manufacturing techniques; Galvanizing; Impurities; Lead; Liquids; Printed circuits; Surface cleaning; Surface finishing; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd

Conference_Location

Greenwich

Print_ISBN

978-1-4244-2813-7

Electronic_ISBN

978-1-4244-2814-4

Type

conf

DOI

10.1109/ESTC.2008.4684335

Filename

4684335