Title :
Multi-chip SiC DMOSFET half-bridge power module for high temperature operation
Author :
Funaki, Tsuyoshi ; Sasagawa, Masashi ; Nakamura, Takashi
Author_Institution :
Div. Electr., Electron. & Inf. Eng., Osaka Univ., Suita, Japan
Abstract :
The authors developed 80A, 1200V half bridge SiC power module for high temperature operation with connecting multiple small current rating SiC MOSFETs in parallel on a ceramic substrate. This paper characterizes and evaluates the static characteristics and switching operation capability of the developed power module from room temperature (25C) to high temperature condition (200C). First, the static current-voltage characteristics for wide temperature range are tested, and then terminal capacitance-voltage characteristics are evaluated. The switching behavior of the SiC power module is experimented and the temperature dependencies are evaluated. The results clarified the high temperature operation capability of the developed SiC power module without degrading fast switching capability.
Keywords :
MOSFET circuits; ceramics; multichip modules; power integrated circuits; silicon compounds; wide band gap semiconductors; SiC; ceramic substrate; current 80 A; fast switching capability; high temperature operation; multichip DMOSFET half-bridge power module; static characteristics; static current-voltage characteristics; switching behavior; switching operation capability; temperature 25 C to 200 C; terminal capacitance-voltage characteristics; voltage 1200 V; Logic gates; MOSFET circuits; Multichip modules; Silicon carbide; Temperature; Temperature measurement; Threshold voltage;
Conference_Titel :
Applied Power Electronics Conference and Exposition (APEC), 2012 Twenty-Seventh Annual IEEE
Conference_Location :
Orlando, FL
Print_ISBN :
978-1-4577-1215-9
Electronic_ISBN :
978-1-4577-1214-2
DOI :
10.1109/APEC.2012.6166178