Title :
Development of an in-situ, non-destructive ultrasonic monitoring technique for solder pastes
Author :
Seman, A. ; Ekere, N.N. ; Ashenden, S.J. ; Mallik, S. ; Marks, A.E. ; Durairaj, R.
Author_Institution :
Electron. Manuf. Eng. Res. Group Medway Sch. of Eng., Univ. of Greenwich, Chatham
Abstract :
This paper concerns the use of a non-destructive ultrasonic technique for characterising the rheological properties of solder paste and specifically, the use of through-mode microsecond ultrasonic pulses for evaluation of viscoelastic properties of paste materials at the molecular level.
Keywords :
rheology; solders; ultrasonic materials testing; viscoelasticity; in-situ nondestructive ultrasonic monitoring technique; rheological properties; solder pastes; through-mode microsecond ultrasonic pulses; viscoelastic properties; Material properties; Materials testing; Monitoring; Printing; Production; Quality control; Rheology; Sugar industry; Ultrasonic imaging; Ultrasonic variables measurement;
Conference_Titel :
Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
Conference_Location :
Greenwich
Print_ISBN :
978-1-4244-2813-7
Electronic_ISBN :
978-1-4244-2814-4
DOI :
10.1109/ESTC.2008.4684351
