DocumentCode
3515163
Title
Development of an in-situ, non-destructive ultrasonic monitoring technique for solder pastes
Author
Seman, A. ; Ekere, N.N. ; Ashenden, S.J. ; Mallik, S. ; Marks, A.E. ; Durairaj, R.
Author_Institution
Electron. Manuf. Eng. Res. Group Medway Sch. of Eng., Univ. of Greenwich, Chatham
fYear
2008
fDate
1-4 Sept. 2008
Firstpage
209
Lastpage
214
Abstract
This paper concerns the use of a non-destructive ultrasonic technique for characterising the rheological properties of solder paste and specifically, the use of through-mode microsecond ultrasonic pulses for evaluation of viscoelastic properties of paste materials at the molecular level.
Keywords
rheology; solders; ultrasonic materials testing; viscoelasticity; in-situ nondestructive ultrasonic monitoring technique; rheological properties; solder pastes; through-mode microsecond ultrasonic pulses; viscoelastic properties; Material properties; Materials testing; Monitoring; Printing; Production; Quality control; Rheology; Sugar industry; Ultrasonic imaging; Ultrasonic variables measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
Conference_Location
Greenwich
Print_ISBN
978-1-4244-2813-7
Electronic_ISBN
978-1-4244-2814-4
Type
conf
DOI
10.1109/ESTC.2008.4684351
Filename
4684351
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