• DocumentCode
    3515238
  • Title

    Investigation of thick film electronic packaging materials in dynamic contact with artificial body fluids

  • Author

    Beshchasna, N. ; Engelien, E. ; Uhlemann, J. ; Wolter, K. -J

  • Author_Institution
    Dept. of Electr. Eng. & Inf. Technol., Tech. Univ. Dresden, Dresden
  • fYear
    2008
  • fDate
    1-4 Sept. 2008
  • Firstpage
    253
  • Lastpage
    258
  • Abstract
    Thick film electronic packaging materials based on Ag-Pt (C4729), Ag-Pd (C2030) and Pt (LPA 88-11) conductive pastes were tested on their properties under the influence of flowing artificial blood plasma (ABP), artificial cerebrospinal fluid (ACF) and physiological solution (0.9% NaCl) for the evaluation of their biostability grade in vitro. The degradation effects were studied by means of microscopic investigations, measurements of a surface free energy, determination of mass losses and analysis of a chemical content. Materials were stressed in fluid mediums during the periods of up to 60 days at the temperature of 60degC, pH value of (8-10) and flow velocity of 0.15 m/s in systems with a directional flow and by an unidirectional fluid circulation. Based on SEM-EDX analysis, formation of silver sulphide (Ag2S) in form of yellow-brown precipitate has been observed on Ag-Pt surfaces, which were influenced by ABP and ACF; a partly dissolution of Zn and Na particles from pastes glass matrix was supposed. No significant alterations in chemical content were revealed in case of interactions between Ag-Pt thick films and 0.9% NaCl. Ag-Pd surfaces were more stable due to formation of the protection palladium oxide (PdO) film. A very good stability have shown Pt-layers.
  • Keywords
    biomedical electronics; electronics packaging; prosthetics; artificial blood plasma; artificial body fluids; artificial cerebrospinal fluid; biostability grade in vitro; dynamic contact; physiological solution; thick film electronic packaging materials; Biological materials; Blood; Chemical analysis; Conducting materials; Electronic equipment testing; Electronics packaging; Fluid dynamics; Materials testing; Plasma properties; Thick films;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
  • Conference_Location
    Greenwich
  • Print_ISBN
    978-1-4244-2813-7
  • Electronic_ISBN
    978-1-4244-2814-4
  • Type

    conf

  • DOI
    10.1109/ESTC.2008.4684358
  • Filename
    4684358