Title :
X-ray lithography: overview and outlook
Author_Institution :
Semicond. Res. & Dev. Center, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
Abstract :
Summary form only given. The authors describes X-ray lithography (XRL) and current results from various laboratories around the world. The status and challenges associated with the various technology elements (the source, the optics, the aligner, the mask, and the photoresist) are discussed. Finally, the outlook for successfully inserting XRL into semiconductor manufacturing are assessed.
Keywords :
X-ray lithography; X-ray masks; integrated circuit technology; resists; semiconductor technology; X-ray lithography overview; aligner; electron resists; laboratories; mask; optics; photoresist; semiconductor manufacturing; technology elements; Gas lasers; Integrated circuit technology; Laboratories; Lenses; Optical device fabrication; Optical pulses; Optical sensors; Plasma sources; Ultraviolet sources; X-ray lithography;
Conference_Titel :
Lasers and Electro-Optics, 1998. CLEO 98. Technical Digest. Summaries of papers presented at the Conference on
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
1-55752-339-0
DOI :
10.1109/CLEO.1998.675900
