DocumentCode
3515643
Title
Resistors testing by noise, non-linearity and Electro-Ultrasonic Spectroscopy
Author
Sedlakova, V. ; Tofel, P. ; Chvatal, M. ; Sikula, J.
Author_Institution
Phys. Dept. of FEEC, Brno Univ. of Technol., Brno
fYear
2008
fDate
1-4 Sept. 2008
Firstpage
387
Lastpage
392
Abstract
The quality and reliability of polymer based and cermet thick film layers were tested both by standard testing methods based on the measurements of the low frequency noise spectra and AV characteristic nonlinearity and new proposed method Electro-Ultrasonic Spectroscopy. The samples were made using different resistive and conducting pastes, both laboratory and commercially produced. The results of standard measuring methods are compared with those of the electro-ultrasonic spectroscopy. This method is based on the phonon interaction with conducting electrons and on the change of the contact area among the conducting particles. The ultrasonic signal changes the contact area between the conducting grains in the resistor structure and then the resistance is modulated by the frequency of ultrasonic excitation. Resultant intermodulation voltage appearing on the sample depends on the value of ac current varying with frequency fE and on the ultrasonic excited resistance change DeltaR varying with frequency fU. Ultrasound-excited resistance change in polymer based thick film structures is about 0.4 mOmega to 13 mOmega, which corresponds to the relative resistance change of the order from 10-6. For the cermet structures the resistance change is about 0.2 mOmega to 0.4 mOmega, which corresponds to the relative resistance change of the order from 10-8. The intermodulation signal can be used as the quality and reliability indicator.
Keywords
acoustoelectric effects; cermets; noise; phonons; polymer films; ultrasonic applications; cermet thick film layers; conducting particles; conducting pastes; contact area; electro-ultrasonic spectroscopy; intermodulation voltage; low frequency noise spectra; phonon interaction; polymer; reliability indicator; resistor structure; resistors testing; thick film structures; ultrasonic excitation; ultrasonic excited resistance change; Ceramics; Frequency measurement; Low-frequency noise; Measurement standards; Polymer films; Resistors; Spectroscopy; Testing; Thick films; Thickness measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
Conference_Location
Greenwich
Print_ISBN
978-1-4244-2813-7
Electronic_ISBN
978-1-4244-2814-4
Type
conf
DOI
10.1109/ESTC.2008.4684380
Filename
4684380
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