Determination of moisture ingress through various encapsulants used in CIGS PV module under continuously varying environment

Author

Kim, Namsu ; Han, Changwoon ; Lee, Jaehoon ; Baek, Dohyun ; Kim, Dongseop

Author_Institution

Korea Electron. Res. Center, Seongnam, South Korea

fYear

2012

fDate

3-8 June 2012

Abstract

It has been reported that water vapor ingress and saturation of encapsulant materials dominantly impact on longterm reliability of copper indium gallium selenide PV cells. To understand diffusion mechanism of water vapor into PV module, diffusion coefficient and solubililty of various encapsulants and their temperature dependency were investigated. Based on experimentally determined permeation properties, governing equation for time dependent diffusion were solved using finite element method software to suggest design guideline for packaging of PV module for long-term reliability.

Keywords

copper compounds; diffusion; encapsulation; finite element analysis; gallium compounds; indium compounds; moisture; permeability; semiconductor device reliability; solar cells; solubility; ternary semiconductors; CIGS PV module; Cu(InGa)Se₂; continuously varying environment; diffusion coefficient; diffusion mechanism; encapsulant material saturation; finite element method; moisture ingress determination; reliability; solubililty; water vapor ingress; Boundary conditions; Equations; Finite element methods; Glass; Mathematical model; Software; Transient analysis; CIGS PV module; Water vapor; diffusion coefficient; encapsulant; solubility;

fLanguage

English

Publisher

ieee

Conference_Titel

Photovoltaic Specialists Conference (PVSC), 2012 38th IEEE

Conference_Location

Austin, TX

ISSN

0160-8371

Print_ISBN

978-1-4673-0064-3

Type

conf

DOI

10.1109/PVSC.2012.6317744

Filename

6317744