Title :
Various characteristics of crystal oscillator which applies technology of IC
Author :
Makuta, Toshikasu ; Ishimaru, Chisato ; Okazaki, Masanobu
Author_Institution :
Nihon Dempa Kogyo Co. Ltd., Saitama, Japan
Abstract :
The processing technology of IC (Facedown bonding) is effective for making the low height IC. By using of Facedown bonding technique, we can develop the ultra slim crystal oscillator of 5×3.2×1.0 mm size. Furthermore by using the PLL technology, the output frequency can be realized in the 1-125 MHz range
Keywords :
crystal oscillators; integrated circuit packaging; integrated circuit reliability; integrated circuit technology; microassembling; phase locked loops; 1 mm; 1 to 125 MHz; 1-125 MHz; 3.2 mm; 5 mm; IC; PLL technology; crystal oscillator; facedown bonding; output frequency; processing technology; ultra slim crystal oscillator; Bonding; Electric shock; Frequency; Integrated circuit packaging; Integrated circuit testing; Oscillators; Packaging machines; Petroleum; Phase noise; Wire;
Conference_Titel :
Frequency and Time Forum, 1999 and the IEEE International Frequency Control Symposium, 1999., Proceedings of the 1999 Joint Meeting of the European
Conference_Location :
Besancon
Print_ISBN :
0-7803-5400-1
DOI :
10.1109/FREQ.1999.840777
