DocumentCode
3515845
Title
A low-tech solution to avoid the severe impact of transient errors on the IP interconnect
Author
Graham, Derek ; Strid, Per ; Roy, Scott ; Rodriguez, Fernando
Author_Institution
Inst. for Syst. Level Integration, Livingston, UK
fYear
2009
fDate
June 29 2009-July 2 2009
Firstpage
478
Lastpage
483
Abstract
There are many sources of failure within a system-on-chip (SoC), so it is important to look beyond the processor core at other components that affect the reliable operation of the SoC, such as the fabric included in every one that connects the IP together. We use ARM´s AMBA 3 AXI bus matrix to demonstrate that the impact of errors on the IP interconnect can be severe: possibly causing deadlock or memory corruption. We consider the detection of 1-bit transient faults without changing the IP that connects to the bus matrix or the AMBA 3 standard and without adding extra latency while keeping the performance and area overhead low. We explore what can be done under these constraints and propose a combination of techniques for a low-tech solution to detect these rare events.
Keywords
IP networks; fault tolerant computing; system buses; system-on-chip; AMBA 3 AXI bus matrix; IP interconnect; system-on-chip; transient faults detection; Automotive engineering; Availability; Circuit faults; Delay; Electromagnetic interference; Event detection; Fabrics; Fault detection; Integrated circuit interconnections; Logic;
fLanguage
English
Publisher
ieee
Conference_Titel
Dependable Systems & Networks, 2009. DSN '09. IEEE/IFIP International Conference on
Conference_Location
Lisbon
Print_ISBN
978-1-4244-4422-9
Electronic_ISBN
978-1-4244-4421-2
Type
conf
DOI
10.1109/DSN.2009.5270301
Filename
5270301
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