DocumentCode :
351603
Title :
N degrees of separation: multi-dimensional separation of concerns
Author :
Tarr, Peri ; Ossher, Harold ; Harrison, William ; Sutton, Stanley M., Jr.
Author_Institution :
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
fYear :
1999
fDate :
22-22 May 1999
Firstpage :
107
Lastpage :
119
Abstract :
Done well, separation of concerns can provide many software engineering benefits, including reduced complexity, improved reusability, and simpler evolution. The choice of boundaries for separate concerns depends on both requirements on the system and on the kind(s) of decomposition and composition a given formalism supports. The predominant methodologies and formalisms available, however, support only orthogonal separations of concerns, along single dimensions of composition and decomposition. These characteristics lead to a number of well-known and difficult problems. The paper describes a new paradigm for modeling and implementing software artifacts, one that permits separation of overlapping concerns along multiple dimensions of composition and decomposition. This approach addresses numerous problems throughout the software lifecycle in achieving well-engineered, evolvable, flexible software artifacts and traceability across artifacts.
Keywords :
program slicing; programming environments; software prototyping; software quality; software reusability; systems analysis; complexity; evolution; hypermodules; hyperslices; multi-dimensional separation of concerns; multiple dimensions; orthogonal separations; overlapping concerns; reusability; separate concerns; software artifacts; software decomposition; software engineering benefits; software lifecycle; system requirements; traceability; Contracts; Costs; Laboratories; Large-scale systems; Production; Rivers; Software engineering; Software maintenance; Software quality; Software systems;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Software Engineering, 1999. Proceedings of the 1999 International Conference on
Conference_Location :
Los Angeles, CA, USA
ISSN :
0270-5257
Print_ISBN :
1-58113-074-0
Type :
conf
Filename :
841000
Link To Document :
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