RF multi-DUT testing technology for RF WLP

Test efficiency of packaged electronics strongly depends on test time and test cost because test time increase causes the increase of test cost. In this paper, with RF WLP devices fabricated by wafer level package processes, we have demonstrated RF multi-DUT testing technology with superior measurement stability and enhanced package yield in RF wafer level test. We could know that RF multi-DUT testing technology for RF WLP devices in wafer level testing has test time reduction of 61.9% compared to test time of RF single-DUT testing through analyzing test time. This technology can offer a number of significant advantages such as productivity improvement and superior capabilities for high performance RF wafer level testing. RF multi-DUT testing technology is essential in addressing future needs for testing RF WLP devices on the wafer.