DocumentCode
3516127
Title
Global joint effort to solve electronics supply chain technology issues
Author
Bergman, Ruben ; Andrews, Marshall ; Collander, Paul
Author_Institution
Poltronic, Alvsjo
fYear
2008
fDate
1-4 Sept. 2008
Firstpage
557
Lastpage
560
Abstract
High Density Packaging User Group, HDPUG, is an international consortium working with specific, most urgent, technology issues related to the changing world of electronics industry needs and complex supply chains. The organisation has for 12 years offered industrial top players a collaborative base for analysing, testing and improving emerging technologies at and before their public introduction. Suppliers and users working together at that stage improve business efficiency and performance up and down the supply chain.
Keywords
fine-pitch technology; integrated circuit packaging; supply chains; surface mount technology; electronics supply chain technology; fine pitch surface mount technology; integrated circuit packaging; Chemical analysis; Chemical technology; Electronics industry; Electronics packaging; Europe; Industrial electronics; Isolation technology; Semiconductor device packaging; Supply chains; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
Conference_Location
Greenwich
Print_ISBN
978-1-4244-2813-7
Electronic_ISBN
978-1-4244-2814-4
Type
conf
DOI
10.1109/ESTC.2008.4684410
Filename
4684410
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