Title :
Growth mechanism of copper column by electrodeposition for electronic interconnections
Author :
Liu, Jun ; Liu, Changqing ; Conway, Paul P.
Author_Institution :
Wolfson Sch. of Mech. & Manuf. Eng., Loughborough Univ., Loughborough
Abstract :
Formation mechanism of copper columns by electrodeposition has been discussed by observing the evolution of surface morphology and microstructure of these columns electrodeposited from 16ms to 3 hours. Based on this study, a heuristic model is proposed to describe the growth mechanism of copper column which provides guidance for controlling microstructure of electrodeposited copper columns for fine pitch electronic interconnections.
Keywords :
copper; crystal microstructure; electrodeposition; integrated circuit interconnections; surface morphology; Cu; copper columns; electrodeposition; fine pitch electronic interconnections; microstructure; surface morphology; time 16 ms to 3 h; Copper; Electrodes; Grain boundaries; Microelectronics; Microstructure; Packaging; Resists; Soldering; Surface morphology; Testing;
Conference_Titel :
Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
Conference_Location :
Greenwich
Print_ISBN :
978-1-4244-2813-7
Electronic_ISBN :
978-1-4244-2814-4
DOI :
10.1109/ESTC.2008.4684432
