• DocumentCode
    3516470
  • Title

    Sonochemistry — a sound approach to surface modification

  • Author

    Cobley, Andy ; Mason, Tim

  • Author_Institution
    Fac. of Health & Life Sci., Coventry Univ., Coventry
  • fYear
    2008
  • fDate
    1-4 Sept. 2008
  • Firstpage
    685
  • Lastpage
    690
  • Abstract
    The surface modification of dielectric materials is required throughout the electronics industry. Traditional chemical methods however tend to be characterised by the use of hazardous substances, high temperature operation and long process times. Previous work has shown that significant surface modification of substrates used in electronic manufacturing can be achieved by applying ultrasound of an appropriate frequency through liquids as benign as water. In this work a number of factors which can affect the phenomenon of acoustic cavitation are investigated along with their subsequent impact on surface modification. It was found that all the process variations considered caused a greater weight loss compared to the standard sonochemical technique. However, adding a small amount of a surfactant containing product also increased roughness, improved wettability and produced samples with a dramatic change in morphology.
  • Keywords
    cavitation; dielectric materials; electronics packaging; nonlinear acoustics; surface morphology; surfactants; acoustic cavitation; dielectric materials; electronic manufacturing; electronics industry; hazardous substances; sonochemistry; sound approach; standard sonochemical technique; surface modification; surfactant; wettability; Chemical hazards; Chemical processes; Dielectric materials; Dielectric substrates; Electronics industry; Frequency; Manufacturing; Surface morphology; Temperature; Ultrasonic imaging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
  • Conference_Location
    Greenwich
  • Print_ISBN
    978-1-4244-2813-7
  • Electronic_ISBN
    978-1-4244-2814-4
  • Type

    conf

  • DOI
    10.1109/ESTC.2008.4684433
  • Filename
    4684433