High frequency characterization and modelling of inkjet printed interconnects on flexible substrate for low-cost RFID applications

Author

Shao, Botao ; Weerasekera, Roshan ; Woldegiorgis, Abraham Tareke ; Zheng, Li-Rong ; Liu, Ran ; Zapka, Werner

Author_Institution

ECS/ICT, KTH, Stockholm

fYear

2008

fDate

1-4 Sept. 2008

Firstpage

695

Lastpage

700

Abstract

This paper presents the characterization and modeling of inkjet printed interconnects on flexible polyimide substrate using nano-particle silver ink for low-cost RFID applications. Then TDR/TDT and S-parameter measurements are performed at high frequency from 30 kHz to 6 GHz. A lumped equivalent circuit and distributed parameter model of the printed interconnects have been developed for the realization of the full printed RFID tags. Additionally the related electrical properties of the printed interconnects are extracted.

Keywords

S-parameters; equivalent circuits; flexible electronics; integrated circuit interconnections; integrated circuit modelling; nanoparticles; printed circuits; radiofrequency identification; S-parameter measurements; flexible polyimide substrate; flexible substrate; high frequency characterization; inkjet printed interconnects; low-cost RFID applications; lumped equivalent circuit; nanoparticle silver ink; printed interconnects; Equivalent circuits; Frequency measurement; Ink; Integrated circuit interconnections; Performance evaluation; Polyimides; RFID tags; Radiofrequency identification; Scattering parameters; Silver;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd

Conference_Location

Greenwich

Print_ISBN

978-1-4244-2813-7

Electronic_ISBN

978-1-4244-2814-4

Type

conf

DOI

10.1109/ESTC.2008.4684435

Filename

4684435