Title :
Evolution of VLSIs materials and packaging technology correlated with progress of thin films deposition and outlets bonding methods
Author :
Emelyanov, Victor ; Baranov, Valentine ; Emelyanov, Anton
Author_Institution :
Corp. "Integral", Minsk
Abstract :
The main results concerning vacuum deposition of thin films to the silicon wafers and local electrochemical covering to the interconnecting frame have been described in the paper. These methods and technological conditions have been developed in order to meet the requirements of the process of VLSIs packaging into plastic housings.
Keywords :
VLSI; aluminium alloys; bonding processes; copper alloys; elemental semiconductors; integrated circuit interconnections; integrated circuit packaging; nickel alloys; silicon; vacuum deposition; Al; Cu; Ni; VLSI materials; crystal grain size; element mixture; frame interconnection; housings type selection; local electrochemical covering; outlets bonding methods; packaging technology; plastic housings; silicon wafers; thin films deposition; vacuum deposition; Bonding; Conducting materials; Costs; Gold; Isolation technology; Plastic packaging; Silicon; Sputtering; Thermal resistance; Very large scale integration;
Conference_Titel :
Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
Conference_Location :
Greenwich
Print_ISBN :
978-1-4244-2813-7
Electronic_ISBN :
978-1-4244-2814-4
DOI :
10.1109/ESTC.2008.4684450
