Evolution of VLSIs materials and packaging technology correlated with progress of thin films deposition and outlets bonding methods

Author

Emelyanov, Victor ; Baranov, Valentine ; Emelyanov, Anton

Author_Institution

Corp. "Integral", Minsk

fYear

2008

fDate

1-4 Sept. 2008

Firstpage

779

Lastpage

784

Abstract

The main results concerning vacuum deposition of thin films to the silicon wafers and local electrochemical covering to the interconnecting frame have been described in the paper. These methods and technological conditions have been developed in order to meet the requirements of the process of VLSIs packaging into plastic housings.

Keywords

VLSI; aluminium alloys; bonding processes; copper alloys; elemental semiconductors; integrated circuit interconnections; integrated circuit packaging; nickel alloys; silicon; vacuum deposition; Al; Cu; Ni; VLSI materials; crystal grain size; element mixture; frame interconnection; housings type selection; local electrochemical covering; outlets bonding methods; packaging technology; plastic housings; silicon wafers; thin films deposition; vacuum deposition; Bonding; Conducting materials; Costs; Gold; Isolation technology; Plastic packaging; Silicon; Sputtering; Thermal resistance; Very large scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd

Conference_Location

Greenwich

Print_ISBN

978-1-4244-2813-7

Electronic_ISBN

978-1-4244-2814-4

Type

conf

DOI

10.1109/ESTC.2008.4684450

Filename

4684450